Metal Copper Clad Laminate

Top Aluminum CCL Manufacturer OEM/ODM PCB Substrate Solutions

Metal Copper Clad Laminate

Top Aluminum CCL Manufacturer OEM/ODM PCB Substrate Solutions

Aluminum Copper Clad Laminate

Metal Copper Clad Laminate (MCCL)​​

MCCL combines an aluminum substrate with copper cladding to deliver superior thermal management and electrical performance. Ideal for LED lighting, automotive electronics, and power modules, its high thermal conductivity (up to 9.0 W/m·K) efficiently dissipates heat, ensuring device longevity and stability. The lightweight aluminum core reduces system weight while maintaining structural rigidity, making it a cost-effective alternative to traditional FR-4 or ceramic substrates.

​Tailored Solutions & Expertise​
We specialize in custom MCCL production, offering thicknesses from 0.2mm to 200mm, copper ratios (5%-30%), and surface finishes like OSP/HAL LF. With ISO9001 and UL certifications, we provide rapid prototyping (3–5 days), free A4 samples, and OEM/ODM services to meet diverse industrial demands, from EV batteries to high-frequency circuits.

Aramid Cloth

Metal Copper Clad Laminate (MCCL)​​

MCCL combines an aluminum substrate with copper cladding to deliver superior thermal management and electrical performance. Ideal for LED lighting, automotive electronics, and power modules, its high thermal conductivity (up to 9.0 W/m·K) efficiently dissipates heat, ensuring device longevity and stability. The lightweight aluminum core reduces system weight while maintaining structural rigidity, making it a cost-effective alternative to traditional FR-4 or ceramic substrates.

​Tailored Solutions & Expertise​
We specialize in custom MCCL production, offering thicknesses from 0.2mm to 200mm, copper ratios (5%-30%), and surface finishes like OSP/HAL LF. With ISO9001 and UL certifications, we provide rapid prototyping (3–5 days), free A4 samples, and OEM/ODM services to meet diverse industrial demands, from EV batteries to high-frequency circuits.

About Metal Copper Clad Laminate

Superior Heat Control​

MCCL dissipates heat efficiently with ​9.0 W/m·K thermal conductivity, ideal for LED lighting and automotive electronics to prevent overheating.

​Lightweight & Durable

MCCL reduces system weight by ​50%​​ vs ceramic/FR-4, maintaining rigidity for aerospace and EV battery modules in extreme conditions.

Custom Solutions​

Tailored MCCL with ​0.2-200mm thickness​ and ​5%-30% copper ratio, backed by ISO/UL certifications and rapid prototyping in 3–5 days.

Item Test Method EM-301 EM-302 EM-302H EM-303 EM-303H EM-305 EM-310
(W/m·k)
Thermal Conductivity		 ASTM D-5470 1.2 1.8 2.2 2.8 2.8 3.5 10.0
(°C/W)
Thermal Resistance		 ASTM D-5470 <0.5 <0.2 <0.11 <0.08 <0.06 <0.05 <0.03
Tg
Glass Transition Temp. (°C)		 IPC-TM-650 2.4.25 130 130 150 180 180 180 180
MOT
Maximum Operation Temp. (°C)		 – 130 130 150 180 180 180 180
[AC KV/mm] Dielectric Breakdown Voltage IPC-TM-650 2.5.6.2 >20 >30 >25 >20 >15 >30 >20
DC (KV/mm)
Dielectric Breakdown Voltage		 IPC-TM-650 2.5.6.2 >40 >40 >20 >25 >25 >40 >40
Volume Resistivity (Ω·cm) IPC-TM-650 2.5.17.1 1.5×1015 2.0×1015 2.0×1015 2.0×1015 3.0×1017 1.0×1018 1.0×1016
Surface Resistivity (Ω) IPC-TM-650 2.5.17.1 4.25×1013 4.25×1013 4.25×1013 4.25×1013 3.0×1016 1.0×1018 1.0×1013
(kg/cm)
Copper Peel Strength @1oz Cu		 IPC-TM-650 2.4.8 >1.4 >1.4 >1.3 >1.2 >1.2 >1.0 >0.8
(Min)
T288, floating on solder		 JIS C 6481 >10 >10 >10 >5 >10 >10 >10
(°C)
Thermal Decomposition Temp (2%)		 ASTM D 3850 350 350 350 350 350 400 380
(°C)
Thermal Decomposition Temp (5%)		 ASTM D 3850 410 410 410 410 410 450 430
CTE (Coefficient of Thermal Expansion) below Tg [PPM/°C] Thermal Expansion IPC-TM-650 2.4.24 75 55 55 55 55 53 48
CTE (Coefficient of Thermal Expansion) above Tg [PPM/°C] Thermal Expansion IPC-TM-650 2.4.24 300 60 60 33 33 33 30
CTI (V)
Comparative Tracking Index		 UL 746 600 600 600 600 600 600 600
Flammability, UL-94, Class UL 94 V-0 V-0 V-0 V-0 V-0 V-0 V-0
(Dk)
Dielectric Constant, 1GHz		 IPC-TM-650 2.5.5.9 4.68 4.68 6.6 6.6 4.8 4.8 4.4
(Df)
Dissipation Factor, 1GHz		 IPC-TM-650 2.5.5.9 0.013 0.013 0.018 0.020 0.016 0.015 0.012

Some Of The Applications Of Metal Copper Clad Laminate

  • High power LED
  • Car headlights
  • Home appliances
  • LCD TV and soundbox
  • Modifier and sparker for motorcycle and mobile devices
  • Advanced electronic products
  • High-density circuit board
  • Three-dimensional space circuit assembly
  • Circuits and the shell integration assembly
  • Electromagnetic shielding and more

Features Of Metal Copper Clad Laminate

  • Excellent flame retardant
  • Good heat resistance
  • Excellent in thermal conductivity
  • Good electromagnetic shielding and solder float
  • High mechanical strength
  • Very light in weight
  • Top-notch machining properties
  • Quite cost-effective

Product Application

  • Used for making high power LED, car headlights, LCD TV, advanced electronic products, large current, high density and power consumption circuit board, excellent heat dissipation.
  • The implementing circuit assembly of high reliability, long life.
  • Used to make circuits and the shell integration assembly, realizing the short circuit assembly of small, light, thin.
  • Used to make three dimensional space circuit assembly, the thin board has can bend and deformation.
  • Used to make electromagnetic shielding the circuit in the assembly.
  • Used to make need high resistance to thermal shock circuit assembly.
  • Other new circuit assembly.
application

Product Packaging

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